The details were confirmed today by Samsung Display chief executive Yi Chung at an event hosted by South Korean President Lee Jae Myung.
The investment is split across several Samsung subsidiaries. Samsung Display will spend 67 trillion won in the cities of Asan and Cheonan, while Samsung Electronics will invest 56 trillion won to build packaging facilities for high-bandwidth memory (HBM) chips in Onyang and Cheonan, capacity aimed at meeting surging demand for AI accelerator components.
Samsung SDI will commit 9 trillion won by 2040 to production and R&D for next-generation batteries in Cheonan, while Samsung Electro-Mechanics will invest 8 trillion won by the same year in Sejong to produce advanced chip packaging materials for AI servers, alongside efforts to build domestic engineering talent.
The Chungcheong plan forms part of a broader investment package Samsung Group rolled out earlier this week and follows a far larger national push. South Korea is orchestrating investments of at least 1,350 trillion won ($880 billion) from companies including Samsung Electronics and SK Hynix into chips and data centres, which the government has described as essential to the country’s AI-era competitiveness.
As part of that wider programme, Samsung and SK Group have separately pledged to build two new chipmaking plants apiece in South Korea’s southwest, worth a combined 800 trillion won.
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