Samsung Electronics said over the weekend that it signed a memorandum of understanding (MoU) with Broadcom to broaden collaboration on next-generation AI infrastructure.
The deal is expected to include leading-edge memory, foundry technologies and advanced packaging to support the next generation of AI infrastructure. Announced during the AI Summit in San Francisco, both companies expect the collaboration to be more than US$200 billion across memory and foundry until at least 2030.
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” said Young Hyun Jun, vice chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.”
Samsung and Broadcom plan to pursue a strategic collaboration for the supply of memory solutions that include High Bandwidth Memory (HBM), supporting Broadcom’s next-generation AI accelerators. At the start of the month, Samsung anticipated a 1,800% operating profit jump on account of surging AI demand for memory, crediting overwhelming demand for these advanced memory chips that are used in data centres to power AI.
Samsung Electronics has been making significant moves in this area in recent weeks, having also announced a 56 trillion won investment to build packaging facilities for HBM chips in Onyang and Cheonan, with capacity aimed at meeting surging demand for AI accelerator components.
In foundry, the collaboration with Broadcom will focus on Samsung’s 2-nanometer and below process technologies for Broadcom’s products, the company said, including Wireless Broadband Communications (WBC) solutions. The deal is also expected to extend advanced packaging technologies built on this process to enable higher performance and more power-efficient AI and networking silicon.
Under these terms, Samsung believes it’s well-positioned to scale integrated semiconductor solutions for the AI era. With Broadcom, the company said it will continue to support customers with end-to-end semiconductor technologies across a wide range of AI and HPC applications.
“As AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important,” said Charlie Kawwas, president of the semiconductor solutions group at Broadcom. “By combining Samsung’s memory and foundry expertise with Broadcom’s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.”
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